Thermal Conductive  Filler for 0.6~5.0(W/m·K)  Epoxy Adhesive

Description

This series is prepared through unique processing for particles surface coating in order to improve compatibility with epoxy resin, and used as thermal conductive filler for polymeric composites. It displays not only good dispersibility of epoxy polymers even with high filler loading, but also good thermal conductivity, low density, good electrical insulating property.

Features

1.Surface treatment by epoxy system treating agent, low viscosity increase.

2.High flow ability, excellent dispersion in resins.

3.Narrow particle size distribution, steady quality.

Some product applications

GD-E086H：applicable for 0.6~1.0 (W/m·K) thermal conductive & flame retardant epoxy adhesive with low viscosity.

GD-E157H：applicable for 1.0~1.5 (W/m·K) thermal conductive & flame retardant epoxy adhesive.

GD-E352H：applicable for 3.0~5.0 (W/m·K) thermal conductive epoxy adhesive.

GD-E504H：applicable for 5.0 (W/m·K) thermal conductive & flame retardant epoxy adhesive.