Thermal Conductive  Filler for 1.0~8.0(W/m·K) Silicone Pad

Description

The fillers is through the uniform surface coating process, the ideal surface modification of the thermal conductive composite powder is realized, which solves the problems of poor compatibility between the powder and the substrate, ensures excellent dispersion and compatibility in silicone.

Features

1.Reasonable particle size distribution.

2.High bulk density.

3.Low oil absorption, excellent dispersion in silicone.

Some product applications

GD-S119A: applicable for 1.0~1.3(W/m·K)   thermal conductive & flame retardant gasket.

GD-S133A：applicable for 1.7~2.0 (W/m·K) thermal conductive   gasket.

GD-S299A：applicable for 3.0 (W/m·K)   thermal conductive   gasket.

GD-S5201LK：applicable for 5.0(W/m·K) thermal conductive   gasket with low density and low dielectric.

GD-S751A：applicable for 7.0~8.0(W/m·K) thermal conductive   gasket or gel.